3 p 118 122.
Metal plating on ceramic.
The via holes are made by laser drilling.
By the way.
Plating of ceramics with aluminium is not easy by aqueous plating.
Izumi ono 1 tomoji ishii 1 masao mukai 1 1 tokyo institute of technology faculty of engineering released 2009 10 30 received 1974 07 15.
A process is used in hard disk i e zincate nip electroless deposition on al alloy sub almost metal sub.
The key technology of this process is the stability of the via holes.
Also we realize the oem ceramic part we manufacture may itself require further processing in order to be complete.
2 metal layer coated on substrate ex.
And the conducting of the front and back side is connected by the following plating process.
Ceramics can withstand high temperatures and when plated with a specific metal or alloy gain strength and vital electrical conductivity for their use in electronic applications.
By hf or mixture of ammonium bifluoride with nitric acid activation.
Ceramco is a specialized company.
But if you want to plate it with other metals copper nickel gold for example this is the procedure.
The key technology of the metal trace plating is the material control of the sputter layers and the second copper layer stress release during plating.
Gold can be deposited by electroless processes but it is expensive so i would use electroless nickel and then electroplate a very thin layer of gold.
By pd tin activator electroless plating nickel or copper electroplating.
For example a procedure for coating metalworking dies with refractory materials such as molybdenum and tungsten employs a plasma spray gun and low shearing compaction to achieve a highly effective and wear resistant coating.
Commonly used metals and alloys in plating include copper aluminum tin gold zinc silver and nickel.
As such we understand our oem ceramic parts are often only a piece of the bigger picture.
Once etched coat it with an electroless metal.
Plating nickel on ceramics and teflon 2003.
Glass al alloy by electroless plating.
It s easy by vacuum.
In addition to these standard processing methods continuing research in ceramic coating technology has introduced newer techniques that may have a major influence on future ceramics work.
It s possible to plate a variety of metals onto ceramics but it does require the execution of a surface preparation process to promote coating adhesion.
Electroless nickel plating on ceramics.
It is another object of this invention to provide a method for electroless plating of copper on ceramic material where the deposited copper is firmly adhered to the surface.
This typically entails the implementation of electroless plating which closely resembles the standard tank plating method.
Journal of the metal finishing society of japan vol.